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DATA SHEET
CHIP RESISTORS ARRAY
YC164 (8Pin/4R)
5%; 1%
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DataSheet 4 U .com
Product Specification - Dec. 20, 2002 V.03
Supersedes Date of Jun. 04, 2002
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2
Chip Resistor Surface Mount
YC
SERIES
164
6
SCOPE This specification describes YC164 series chip resistors made by thick film process. ORDERING INFORMATION Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and resistance value.
YC164 - X X X XX XXXX
(1) (2) (3) (4) (5)
MARKING
YC164
(1) TOLERANCE
F = 1% J = 5%
ynsc009
First two digits for significant figure and 3rd digit for number of zeros
Fig. 1 5% Marking, Value=5.6
Letter R: decimal place
(2) PACKAGING TYPE
R = Paper taping reel
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(3) TEMPERATURE CHARACTERISTIC OF RESISTANCE
G = 200ppm/C - = Base on spec
ynsc010
Letter 0: Jumper chip (0 ohm)
Fig. 2 Jumper=Zero Ohm
DataShee
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Table 1
H B a T W1 W2
(4) SPECIAL TYPE
07 = 7 inch dia. Reel
TYPE B (mm) H (mm) P (mm) L (mm) H2 (mm) T (mm) W1 (mm) W2 (mm)
YC164
0.30.15 0.650.05 0.80.05 3.20.15 0.50.15 0.60.1 0.30.15 1.60.15
(5) RESISTANCE VALUE:
5R6, 56R, 560R, 5K6, 56K, 56M.
P L a
CCB257_a
H2
Fig. 3 YC164 series chip resistors construction
SCHEMATIC
For dimension see Fig. 3 and Table 1
8 7 6 5
handbook, 2 columns
R1
R2
R3
R4
CCA862_b
1
2
3
4
Fig. 4 Equivalent circuit diagram
R1=R2=R3=R4
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DataSheet 4 U .com
Dec. 20, 2002 V.03
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Chip Resistor Surface Mount
YC
SERIES
164
6
POWER RATING RATED POWER AT 70C, YC164=1/16W FOR ELEMENT
ndbook, halfpage P
ELECTRICAL CHARACTERISTICS
Table 2 CHARACTERISTICS Operating Temperature Range Maximum Working Voltage Maximum Overload Voltage Dielectric Withstanding Voltage Number of Resistors YC164 1/16W
-55C to +125C 50V 100V 100V 4 10 to 1M 200ppm/C
max (%Prated ) 100
MLB206
50
0 55 0 50 70 100 125 o Tamb ( C)
Resistance Range Temperature Coefficient
Fig. 5 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (Tamb)
RATED VOLTAGE:
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The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V=(P X R) Where V=Continuous rated DC or AC (rms) working voltage (V) P=Rated power (W) R=Resistance value (X)
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DataSheet 4 U .com
Dec. 20, 2002 V.03
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4
Chip Resistor Surface Mount
YC
SERIES
164
6
TAPING REEL
Table 3 DIMENSION Tape Width OA (mm) OB (mm) OC (mm) OD (mm) W (mm) Tmax (mm) YC164
8mm 180+0/-3 60+1/-0 13.00.2 210.8 9.00.3 11.41
Fig. 6 Reel dimension
W
MSA284_b
For dimension see Table 3
gewidth
T
D
C
B
A
PAPER TAPE SPECIFICATION
Table 4 DIMENSION A (mm) B (mm) W (mm) E (mm) F (mm) P0 (mm) P1 (mm) P2 (mm) OD0 (mm) Tmax (mm) YC164
2.00.1 3.50.1 8.00.2 1.750.1 3.50.05 4.00.1 4.00.1 2.00.05 1.5+0.1/-0 0.850.1
Fig.7 Paper tape dimension
A P1 P0 D0 P2 E
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F W
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B
T
MBD123_a
For dimension see Table 4
PACKING METHOD LEADER/TRAILER TAPE SPECIFICATION
leader end trailer end
empty compartments with cover tape (min. 240 mm) cover tape only
trailer (max. 260 mm)
leader 400 mm
CCB325
Fig. 8 Leader and trailer tape dimension
Table 5 Packing style and packaging quantity PACKING STYLE Paper Taping Reel (R) REEL DIMENSION
7" (178 mm)
YC164
5,000
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DataSheet 4 U .com
Dec. 20, 2002 V.03
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5
Chip Resistor Surface Mount
YC
SERIES
164
6
TYPE Temperature Coefficient of Resistance (T.C.R.)
TEST METHOD
Measure resistance at +25C or specified room temperature as R1, then measure at -55C or +125C respectively as R2. Determine the temperature coefficient of resistance from the following formula:
ACCEPTANCE STANDARD Formula
R2-R1 T.C.R. = ------------------------- x106 (ppm/C) R1(t2-t1) Where t1=+25C or specified room temperature t2=-55C or +125C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms Refer to table 2
Thermal Shock
At -553C for 2 minutes and at +1252C for 2 minutes as one cycle. After 5 cycles, the specimen shall be stabilized at room temp. Measure the resistance to determine R/R(%) after one more hour.
(1%+0.05)
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Low Temperature Operation
Place the specimen in a test chamber maintained at -65 (+0/-5)C. After one hour stabilization at this temperature, full rated working voltage shall be applied for 45 (+5/-0) minutes. Have15 (+5/-0 ) minutes after remove the voltage, the specimen shall be removed from the chamber and stabilized at room temperature for 24 hrs. Measure the resistance to determine R/R(%). .com
(1.0%+0.05) No visible damage
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Short Time Overload
Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. Measure the resistance to determine R/R(%).
(2.0%+0.05) No visible damage
Insulation Resistance
Place the specimen in the jig and apply a rated continues overload voltage (R.C.O.V) for one minute as shown. Measure the insulation resistance.
Type Voltage
YC164
100V
10,000M
Dielectric Withstand Voltage
Place the specimen in the jig and apply a specified value continuous overload voltage as shown for one minute.
Type Voltage
YC164
100V
Breakdown voltage> specification and without open/short
Resistance To Soldering Heat
Immerse the specimen in the solder pot at 2605C. for 101 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. Measure the resistance to determine R/R(%).
(1.0%+0.05) No visible damage
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Dec. 20, 2002 V.03
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6
Chip Resistor Surface Mount
YC
SERIES
164
6
TYPE Moisture Resistance
TEST METHOD
Place the specimen in the test chamber and subject to 42 damp heat cycles. Each one of which consists of the steps 1 to 7 as figure 10. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for 24 hours after testing. Measure the resistance to determine R/R(%).
ACCEPTANCE STANDARD
(2.0%+0.05) No visible damage
Life
Place the specimen in the oven at 702C. Apply the rated voltage to the specimen at the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for one hour minimum after testing. Measure the R/R(%).
(3%+0.1) for 5% tolerance No visible damage
Solderability
Immerse the specimen in the solder pot at 2305C for 5 sec.
At least 95% solder coverage on the termination (1.0%+0.05) No visible damage
Bending Strength
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Mount the specimen on a test board as shown in the figure 9. Slowly apply the force till the board is bent for 51 sec. Measure the R/R(%) at this position.
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Fig. 9 Principle of the bending test
75 temperature [C] 50 initial drying 24 hours
90 - 98% RH
80 - 98% RH
90 - 98% RH
80 - 98% RH
90 - 98% RH
rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes +10 C (+18 F) -2 C (-3.6 F) initial measurements as specified in 2.2 circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber
end of final cycle; measurements as specified in 2.7
25
0
temperature tolerance 2 C (3.6 F) unless otherwise specified STEP1 prior to first cycle only
HBK073
optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle
voltage applied as specified in 2.4
STEP2
STEP3
STEP4
STEP5
STEP6
STEP7
one cycle 24 hours; repeat as specified in 2.5 0 5 10 15 20 time [h] 25
Fig. 10 Conditions by change of temperature
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DataSheet 4 U .com
Dec. 20, 2002 V.03

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